DocumentCode :
1613204
Title :
Characteristics improvement and carrier transportation of CeO2 gate dielectrics with rapid thermal annealing
Author :
Wang, Jer Chyi ; Chiang, Kuo Cheng ; Lei, Tan Fu ; Lee, Chung Len
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2004
Firstpage :
161
Lastpage :
164
Abstract :
In this paper, we have investigated the properties and carrier transportation of ultra-thin cerium dioxide films with rapid thermal annealing. Improved characteristics such as low leakage current, high breakdown voltage and large time-dependent-dielectric-breakdown (TDDB) are obtained owing to the more stoichiometric quality of the CeO2 films after high temperature annealing. Moreover, temperature dependence of gate leakage current under substrate injection is studied, and the carrier conduction mechanisms, including the Frenkel-Poole (F-P) conduction and the Fowler-Nordheim (F-N) tunneling are also proposed, from which we have deduced the energy band diagram of Al/CeO2/n-Si structure for the first time.
Keywords :
Poole-Frenkel effect; aluminium; band structure; cerium compounds; dielectric thin films; leakage currents; rapid thermal annealing; semiconductor device breakdown; tunnelling; Al-CeO2-Si; EOT; Fowler-Nordheim tunneling; Frenkel-Poole conduction; TDDB; carrier conduction mechanisms; carrier transportation; energy band diagram; gate dielectrics; gate leakage current temperature dependence; high breakdown voltage; high temperature annealing; rapid thermal annealing; substrate injection; time-dependent-dielectric-breakdown; ultra-thin cerium dioxide films; Artificial intelligence; Capacitance-voltage characteristics; Cerium; High K dielectric materials; High-K gate dielectrics; Leakage current; Rapid thermal annealing; Road transportation; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Print_ISBN :
0-7803-8454-7
Type :
conf
DOI :
10.1109/IPFA.2004.1345577
Filename :
1345577
Link To Document :
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