Statistical modeling and simulation of SMD-mounting process

The quality of manufactured SMD-boards depends on a lot of factors. There are influences of the used material (printed boards and components) and the quality capabilities of the used processes. To reduce the costs connected with a high quality level (six-sigma-quality) of the produced boards, it is necessary, to detect the most effective factors for increasing quality. The base of this analysis is a statistical model of the whole mounting process. A simulation program was created, to get very quickly results of the expected quality of a concrete combination of process and material properties