Title :
Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage
Author :
Tung, Chih Hang ; Teo, Poi Siong ; Lee, Charles
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
Abstract :
The interface microstructure evolution between SnCuAg lead-free solder and Ni-based alloys under bump metallization (UBM) systems are studied using transmission electron microscopy (TEM). Details on microstructure changes during reflow process and high temperature storage have help to understand some of the reliability concerns on using Pb-free solder in flip-chip packaging technology.
Keywords :
copper alloys; crystal microstructure; flip-chip devices; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; interface structure; microassembling; nickel alloys; reflow soldering; silver alloys; tin alloys; transmission electron microscopy; Ni; Ni-based under bump metallizations; Pb-free solder; SnCuAg; SnCuAg lead-free solder; TEM; UBM; flip-chip packaging technology; high temperature storage; interface microstructure evolution; microstructure changes; reliability concerns; solder reflow; transmission electron microscopy; Artificial intelligence; Electrons; Environmentally friendly manufacturing techniques; Lead; Metallization; Microelectronics; Microstructure; Packaging; Temperature sensors; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Print_ISBN :
0-7803-8454-7
DOI :
10.1109/IPFA.2004.1345604
