Title :
20 μW/MIPS@1.5 V low power ULSIs on SOI technology for wireless applications
Author :
Lee, Mike Myung-Ok ; Asada, Kunihiro
Abstract :
In VLSI/ULSI ICs, high speed was and still is and will be a main concern. However, as the “on the move with anywhere, anytime and anyone” era comes in reality, portability becomes an essential feature of the electronic systems interfacing with non-electronic systems, emphasizing the efficient use of energy as a major design objective. This paper introduces a new optimization criteria in addition to performance and area. New results in energy consumption reduction by processing technology, device structures, circuit techniques, software and system architecture are reviewed. Considerable advances are possible, reducing the power by more than two orders of magnitude
Keywords :
CMOS digital integrated circuits; MOS integrated circuits; ULSI; VLSI; digital signal processing chips; land mobile radio; radio equipment; silicon-on-insulator; 1.5 V; CMOS; DSP IC; MOS structure; SOI technology; VLSI/ULSI IC; area; circuit techniques; device structures; electronic systems; energy consumption reduction; low power ULSI; nonelectronic systems; optimization criteria; performance; portability; processing technology; software architecture; system architecture; wireless applications; Application software; Circuits; Computer interfaces; Digital signal processing; Energy consumption; Frequency; Large scale integration; Parallel processing; Throughput; Ultra large scale integration;
Conference_Titel :
TENCON '97. IEEE Region 10 Annual Conference. Speech and Image Technologies for Computing and Telecommunications., Proceedings of IEEE
Conference_Location :
Brisbane, Qld.
Print_ISBN :
0-7803-4365-4
DOI :
10.1109/TENCON.1997.648214
