DocumentCode
1614253
Title
Microcavity Plasma Arrays Based on Encapsulated Al/Al2 O3 Electrodes: Device Efficiency and Electrical Characteristics for Display Applications
Author
Kim, K.S. ; Park, S.-J. ; Price, A.J. ; Yoon, J.K. ; Eden, J.G.
Author_Institution
Univ. of Illinois, Urbana
fYear
2007
Firstpage
182
Lastpage
182
Abstract
A group of robust microcavity plasma devices has been fabricated in Al/Al2O3 multilayer structures by drawing upon wet chemical processing to grow thin films of nanostructured Al2O3 directly from the Al substrate. Addressable, large scale arrays of microcavity plasma devices having cavities with a diameter of 100-200 mum are successfully formed by a process suitable for low cost manufacturing. This presentation reports device structure and cell designs of microcavity devices for the microdischarge in the various contents of Ne/Xe gas mixture. 20 times 20 arrays of ~200 mum dia. devices operate stably with a Xe content of 10% (and higher) and the pixel-to-pixel emission intensity is quite uniform over the pressure range of 400-800 Torr. The turn-on voltage at Ne/30% Xe was measured to be ~228V without a coating of MgO and the current value was decreased to the 30% of original current in bulk electrode after patterning aluminum electrode. The detailed electrical properties of the device and novel process for the fabrication of large scale arrays (hundreds of cm2) will be presented.
Keywords
aluminium; aluminium compounds; microcavities; plasma devices; plasma displays; plasma sources; MgO coating; Ne-Xe gas mixture; device efficiency; electrical characteristics; encapsulated electrodes; low cost manufacturing; microcavity plasma arrays; microdischarge; multilayer structures; patterning; pixel-to-pixel emission intensity; wet chemical processing; Chemical processes; Electrodes; Large-scale systems; Microcavities; Nonhomogeneous media; Plasma chemistry; Plasma devices; Plasma materials processing; Robustness; Thin film devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2007. ICOPS 2007. IEEE 34th International Conference on
Conference_Location
Albuquerque, NM
ISSN
0730-9244
Print_ISBN
978-1-4244-0915-0
Type
conf
DOI
10.1109/PPPS.2007.4345488
Filename
4345488
Link To Document