• DocumentCode
    1614306
  • Title

    An SoC combining a 132dB QVGA pixel array and a 32b DSP/MCU processor for vision applications

  • Author

    Rüedi, Pierre-François ; Heim, Pascal ; Gyger, Stève ; Kaess, François ; Arm, Claude ; Caseiro, Ricardo ; Nagel, Jean-Luc ; Todeschini, Silvio

  • Author_Institution
    CSEM, Neuchatel
  • fYear
    2009
  • Firstpage
    46
  • Abstract
    Key elements for machine vision are the intra-scene dynamic range of the optical front-end, and a data representation that is as independent as possible from the illumination level. Furthermore, combining an optical front-end and a processor on the same chip enables a single-chip vision system to perform image acquisition, analysis and decision-making. This paper presents a system-on-chip which combines a front-end pixel with a time-domain logarithmic encoding and a variable reference voltage, a 32b processor, a graphical processing unit, 128 KB or SRAM, and several communication interfaces.It offers a 132dB intra-scene dynamic range encoded logarithmically with 149 steps per decade while achieving an FPN of 0.51 LSB. Logarithmic encoding is exploited on-chip to efficiently compute the image contrast by simple subtractions between neighbouring pixels.
  • Keywords
    SRAM chips; computer vision; digital signal processing chips; image sensors; system-on-chip; 32b processor; DSP; MCU processor; QVGA pixel array; SRAM; SoC; data representation; decision-making; graphical processing unit; image acquisition; image contrast; intra-scene dynamic range; machine vision; optical front-end; single-chip vision system; system-on-chip; time-domain logarithmic encoding; variable reference voltage; Decision making; Digital signal processing; Digital signal processing chips; Dynamic range; Image analysis; Lighting; Machine vision; Performance analysis; System-on-a-chip; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-3458-9
  • Type

    conf

  • DOI
    10.1109/ISSCC.2009.4977300
  • Filename
    4977300