DocumentCode :
1614329
Title :
Advanced 3D metrology Atomic Force Microscope
Author :
Hua, Yueming ; Coggins, Cynthia ; Park, Sung
Author_Institution :
Park Syst. Inc., Santa Clara, CA, USA
fYear :
2010
Firstpage :
7
Lastpage :
10
Abstract :
With the continuous shrinkage of feature size in semiconductor devices, the accurate and reliable metrology of these devices has become very challenging. One aspect of metrology which has posed many challenges for integrated circuits (IC) fabrication is sidewall roughness characterization. Although, sidewall roughness is one of the most critical factors that needs to be characterized and well controlled, currently there is no existing technology that can measure the sidewall roughness well. Here, we present a new 3D metrology Atomic Force Microscope (AFM) capable of high resolution sidewall roughness measurements with improved repeatability and accuracy.
Keywords :
integrated circuit measurement; shrinkage; 3D metrology atomic force microscope; continuous shrinkage; integrated circuits fabrication; semiconductor devices; sidewall roughness; Crosstalk; Electron tubes; Force; Image resolution; Imaging; Metrology; Three dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-6517-0
Type :
conf
DOI :
10.1109/ASMC.2010.5551408
Filename :
5551408
Link To Document :
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