DocumentCode :
1614522
Title :
A 4Gb/s/ch 356fJ/b 10mm equalized on-chip interconnect with nonlinear charge-injecting transmit filter and transimpedance receiver in 90nm CMOS
Author :
Kim, Byungsub ; Stojanovic, Vladimir
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA
fYear :
2009
Firstpage :
66
Abstract :
This paper presents a transceiver for fast and energy-efficient global on-chip communication, consisting of a nonlinear charge-injecting (CI) 3-tap transmit filter (TX) and a sampling receiver (RX) with transimpedance pre-amplifier (TIA). Recently, pre-emphasis techniques have demonstrated significantly better energy-efficiency than repeater interconnects. To further improve energy-efficiency over pre-emphasis techniques that require analog subtraction, our TX selects a pattern-dependent current to inject into the wire, performing feed-forward equalization (FFE) while mitigating the nonlinearity of the driver. This 3-tap charge-injecting (CI) FFE enables stronger equalization than the capacitively driven TX or edge-detection pre-emphasis, achieving data-rate of 4 Gb/s over a 1 cm on-chip wire. The TIA at RX improves bandwidth, signal amplitude, and reduces bias power, breaking the trade-offs in conventional resistor termination, and mitigates equalized signal degradation due to impedance changes in dynamic current sensing.
Keywords :
CMOS integrated circuits; charge injection; equalisers; integrated circuit interconnections; nonlinear filters; preamplifiers; transceivers; equalized on-chip interconnect; feed-forward equalization; nonlinear charge-injecting 3-tap transmit filter; sampling receiver; size 10 mm; size 90 nm; transceiver; transimpedance pre-amplifier; transimpedance receiver; Bandwidth; Degradation; Energy efficiency; Feedforward systems; Filters; Repeaters; Resistors; Sampling methods; Transceivers; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-3458-9
Type :
conf
DOI :
10.1109/ISSCC.2009.4977310
Filename :
4977310
Link To Document :
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