DocumentCode
1614781
Title
Process tool cleanliness for clean manufacturing
Author
Chia, V.K.F.
Author_Institution
Balazs Nano Anal., Fremont, CA, USA
fYear
2010
Firstpage
79
Lastpage
83
Abstract
Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts.
Keywords
cleaning; hygiene; semiconductor device manufacture; surface contamination; clean manufacturing; component cleanliness; coupon cleanliness; material cleanliness; part surface contamination; process tool cleanliness; wafer tool cleanliness specifications; Cleaning; Compounds; Materials; Metals; Surface contamination; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location
San Francisco, CA
ISSN
1078-8743
Print_ISBN
978-1-4244-6517-0
Type
conf
DOI
10.1109/ASMC.2010.5551422
Filename
5551422
Link To Document