• DocumentCode
    1614781
  • Title

    Process tool cleanliness for clean manufacturing

  • Author

    Chia, V.K.F.

  • Author_Institution
    Balazs Nano Anal., Fremont, CA, USA
  • fYear
    2010
  • Firstpage
    79
  • Lastpage
    83
  • Abstract
    Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts.
  • Keywords
    cleaning; hygiene; semiconductor device manufacture; surface contamination; clean manufacturing; component cleanliness; coupon cleanliness; material cleanliness; part surface contamination; process tool cleanliness; wafer tool cleanliness specifications; Cleaning; Compounds; Materials; Metals; Surface contamination; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551422
  • Filename
    5551422