High density 3D through silicon stacking manufacturing readiness and challenges

Cost reduction, thermal management, design, and DFT have been described as the "4 horsemen of the Apocalypse for 3D ICs" (P. Garrou, Semiconductor International, PFLE, Oct 16, 2009). While specific 3D thermal management techniques and DFT solutions are likely to remain proprietary to each company, the industry can tame the cost reduction and design beasts by collaborating on common tools, formats, and standards. Cost targets and cost reduction opportunities for 3D high density TSS technology will be described. Standards for the manufacturing supply chain, and for design data formats and associated input data, will be proposed. Taming these challenges will enable effective design and manufacturing supply chains for high density TSS.