• DocumentCode
    1615106
  • Title

    Identification of yield loss sources in the outer dies using SEM based wafer bevel review

  • Author

    Becker, Britta ; Porat, Ronnie ; Eschwege, Hanan

  • Author_Institution
    Appl. Mater., Dresden, Germany
  • fYear
    2010
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    This paper describes a methodology for defect review and process monitoring on wafer´s upper bevel and apex. A case study gives an example of successful application.
  • Keywords
    process monitoring; scanning electron microscopy; wafer bonding; SEM; defect review; outer dies; process monitoring; wafer bevel review; yield loss sources; Adaptive optics; Book reviews; Image edge detection; Monitoring; Optical imaging; Scanning electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551435
  • Filename
    5551435
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1615106