Title :
Method for improved CMP pad conditioning performance
Author :
Menk, G.E. ; Dhandapani, S. ; Garretson, C.C. ; Chang, S.S. ; Fung, J.G. ; Tsai, S.
Author_Institution :
Silicon Syst. Group, CMP Div., Appl. Mater., Sunnyvale, CA, USA
Abstract :
A new pad conditioning arm design enables the use of closed-loop control (CLC) to improve conditioning performance throughout the life of a pad and disk pair. Measured pad conditioner torque is used to monitor and control the conditioning and polish processes in situ and in real time. The CLC system maintains process performance throughout pad life by adjusting the conditioner down force to compensate for process drift, such as the loss of diamond aggressiveness as the disk ages.
Keywords :
chemical mechanical polishing; closed loop systems; planarisation; CMP pad conditioning performance; chemical mechanical planarization; closed-loop control; pad conditioner torque; pad conditioning arm design; polish process; Diamond-like carbon; Films; Force; Process control; Surface treatment; Torque; Torque measurement;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-6517-0
DOI :
10.1109/ASMC.2010.5551441
