DocumentCode :
1615519
Title :
A numerical study of power loss factors in resonant magnetic coupling
Author :
Shimokawa, Satoshi ; Kawano, Hiroyasu ; Matsui, Kiyoto ; Uchida, Akiyoshi ; Taguchi, Masakazu
Author_Institution :
ITS Res. Center, Fujitsu Labs. Ltd., Akashi, Japan
fYear :
2011
Firstpage :
219
Lastpage :
222
Abstract :
We numerically studied the affect of power loss factors in a wireless power transfer system using resonant magnetic coupling. Resonant magnetic coupling is regarded as one of the most promising methods for mid-range wireless charging systems. To make this method practical, it is important to accurately estimate power transfer efficiency and effect of each loss factor in the device-designing stage. We conducted a numerical simulation using an equivalent circuit model and electromagnetic analysis for a mobile-device model. Resonance at 7 MHz between the transmitting and receiving coils was achieved using lumped capacitors attached at the coil ends. In addition to the skin effect, we consider various loss factors such as proximity effect, loss tangent of lumped capacitors, and so on. The results show that the proximity effect significantly decreases the power transfer efficiency of the system, and the loss tangent of lamped capacitor also decreases it by a few percentage points.
Keywords :
electromagnetic coupling; equivalent circuits; inductive power transmission; losses; mobile handsets; power supplies to apparatus; skin effect; electromagnetic analysis; equivalent circuit; frequency 7 MHz; lumped capacitor; midrange wireless charging system; mobile device model; power loss factor; resonant magnetic coupling; skin effect; wireless power transfer system; Capacitance; Coils; Couplings; Integrated circuit modeling; Magnetic resonance; Resistance; Wireless communication; Wireless power; loss tangent; magnetic resonance; proximity effect; stray capacitance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Workshop Series on Innovative Wireless Power Transmission: Technologies, Systems, and Applications (IMWS), 2011 IEEE MTT-S International
Conference_Location :
Uji, Kyoto
ISSN :
2157-362X
Print_ISBN :
978-1-61284-214-1
Type :
conf
DOI :
10.1109/IMWS.2011.5877134
Filename :
5877134
Link To Document :
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