Title :
Transmission line simulation for testing ISDN devices
Author_Institution :
LTX Corp., Westwood, MA, USA
Abstract :
A transmission line model has been developed to simulate the effects of sourcing ISDN (integrated services digital network) waveforms through twisted-pair telephone cable. Circuit simulation models for three different wire gauges have been used to predict the transmission characteristics of arbitrary networks using SPICE simulations. These models have been configured to simulate a standard test network specified by ANSI and have demonstrated good correlation with an actual twisted-pair telephone test network. The models correctly simulate the input and output impedances imposed by cable and effectively model the transmission effects of mismatched terminations. From the simulated frequency response, FIR (finite impulse response) filter coefficients can be derived to allow DSP (digital signal processing) of test waveforms. This allows the testing of ISDN transceivers using signals likely to be encountered in their intended application
Keywords :
ISDN; automatic testing; circuit analysis computing; computerised signal processing; digital simulation; standards; telecommunications computing; transceivers; transmission line theory; waveform analysis; ANSI; FIR; ISDN devices; ISDN transceivers; SPICE simulations; computerised signal processing; correlation; digital signal processing; filter coefficients; finite impulse response; impedances; integrated services digital network; mismatched terminations; simulated frequency response; simulation; standard test network; transmission characteristics; transmission effects; transmission line model; twisted-pair telephone cable; waveforms; wire gauges; Circuit simulation; Circuit testing; Digital signal processing; Distributed parameter circuits; Finite impulse response filter; ISDN; Power cables; Predictive models; Telephony; Transmission lines;
Conference_Titel :
Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
Conference_Location :
Washington, DC
DOI :
10.1109/TEST.1989.82281
