• DocumentCode
    1615545
  • Title

    Copper grain growth in reduced dimensions

  • Author

    Brongersma, S.H. ; Vanstreels, K. ; Wu, W. ; Zhang, W. ; Ernur, D. ; Haen, J.D. ; Terzieva, V. ; Van Hove, M. ; Clarysse, T. ; Carbonell, L. ; Vandervorst, W. ; de Ceuninck, W. ; Maex, K.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2004
  • Firstpage
    48
  • Lastpage
    50
  • Abstract
    The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.
  • Keywords
    copper; grain growth; surface scattering; copper grain growth; line resistance reduction; reduced dimensions; scattering mechanisms; size effect; Acoustic scattering; Annealing; Conductivity; Copper; Grain boundaries; Light scattering; Optical scattering; Optical surface waves; Plasma measurements; Probes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International
  • Print_ISBN
    0-7803-8308-7
  • Type

    conf

  • DOI
    10.1109/IITC.2004.1345680
  • Filename
    1345680
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1615545