DocumentCode :
1615545
Title :
Copper grain growth in reduced dimensions
Author :
Brongersma, S.H. ; Vanstreels, K. ; Wu, W. ; Zhang, W. ; Ernur, D. ; Haen, J.D. ; Terzieva, V. ; Van Hove, M. ; Clarysse, T. ; Carbonell, L. ; Vandervorst, W. ; de Ceuninck, W. ; Maex, K.
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2004
Firstpage :
48
Lastpage :
50
Abstract :
The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.
Keywords :
copper; grain growth; surface scattering; copper grain growth; line resistance reduction; reduced dimensions; scattering mechanisms; size effect; Acoustic scattering; Annealing; Conductivity; Copper; Grain boundaries; Light scattering; Optical scattering; Optical surface waves; Plasma measurements; Probes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International
Print_ISBN :
0-7803-8308-7
Type :
conf
DOI :
10.1109/IITC.2004.1345680
Filename :
1345680
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1615545
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