• DocumentCode
    1615780
  • Title

    High-k/metal gate stacks in gate first and replacement gate schemes

  • Author

    Kesapragada, Sree ; Wang, Rongjun ; Liu, Dave ; Liu, Guojun ; Xie, Zhigang ; Ge, Zhenbin ; Yang, Haichun ; Lei, Yu ; Lu, Xinliang ; Tang, Xianmin ; Lei, Jianxin ; Allen, Miller ; Gandikota, Srinivas ; Moraes, Kevin ; Hung, Steven ; Yoshida, Naomi ; Chang,

  • Author_Institution
    Appl. Mater., Inc., Santa Clara, CA, USA
  • fYear
    2010
  • Firstpage
    256
  • Lastpage
    259
  • Abstract
    In this work, representative high-k/metal gate MOS-capacitor stacks were fabricated in both gate first and replacement gate integration schemes. Aluminum- and lanthanum- based cap layers (both widely accepted as Vt tuning cap layers in the industry), in addition to TiN metal gate, can tune the effective workfunction towards PMOS and NMOS, respectively. Varying Ti:N stoichiometry in TiN can induce >250 mV change in TiN workfunction. 1 volt separation between NMOS and PMOS was achieved by screening various workfunction materials in replacement gate scheme. Substrate modification during the growth of aluminum was key to achieving void-free aluminum gap fill in narrow gate trenches.
  • Keywords
    MOS capacitors; MOSFET; aluminium; lanthanum; stoichiometry; tin compounds; Al; La; NMOS; PMOS; TiN; aluminum-based cap layers; gate first scheme; high-k/metal gate MOS-capacitor stacks; lanthanum-based cap layers; replacement gate scheme; stoichiometry; Aluminum; High K dielectric materials; Logic gates; MOS devices; Tin; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551460
  • Filename
    5551460