• DocumentCode
    1616069
  • Title

    Processor power subsystem architectures

  • Author

    Kollman, Robert ; Chamberlin, Dan

  • Author_Institution
    Adv. Power Supplies, Raytheon Syst. Co., Dallas, TX, USA
  • Volume
    2
  • fYear
    2000
  • fDate
    6/22/1905 12:00:00 AM
  • Firstpage
    1183
  • Abstract
    This trade study compares the cost, weight, volume and reliability of a power subsystem for an avionic processor. It considers a range of options from a centralized power subsystem to a distributed subsystem with an intermediate bus. The centralized approach was found unsuitable for the lower voltage logic devices that will come to the market over the next few years, a distributed approach will be required. An intermediate voltage bus is preferred over prime power distribution due to safety, high voltage insulation and failure modes effects. Choices of the intermediate bus voltage favor lower voltages which allow the use of buck regulators rather than a transformer coupled approach. An intermediate voltage system using buck regulators provides: 50% cost savings; 20% weight reduction; 25 volume reduction; and 75% reliability improvement when compared to a higher (50 V) distribution voltage
  • Keywords
    aerospace computing; avionics; computer power supplies; logic devices; power distribution reliability; safety; 270 V; avionic processor; buck regulators; centralized power subsystem; cost; distribution voltage; failure modes effects; high voltage insulation; intermediate bus; prime power distribution; processor power subsystem architectures; reliability; safety; volume; weight; Aerospace electronics; Costs; Logic devices; Low voltage; Power distribution; Power supplies; Power system reliability; Power systems; Power transformer insulation; Regulators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    0-7803-5864-3
  • Type

    conf

  • DOI
    10.1109/APEC.2000.822837
  • Filename
    822837