DocumentCode
161611
Title
Precision material engineering - an equipment point of view
Author
Mei Chang
Author_Institution
Appl. Mater., Sunnyvale, CA, USA
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
3
Abstract
Novel materials and specialty processes are expanding rapidly. Low power high performance devices 3D transistor, packaging and memory drove the demands. Innovation in new manufacturing methods/hardware and new chemistries are required to meet the challenges. Several examples in the past such as Cu metallization evolution and interface cleaning illustrate the efforts how the equipment vendor overcame the more demanding requirements by introducing more hardware control knobs (such as power, RF frequency, B field distribution, temperature zoning), introducing new chemicals (fine control chemical reaction pathway), new physical/chemistry methods (alternative energy form and source) and tempering with new elements. A proper implementation of advanced capabilities heavily depends on the applications. Better understanding of device integration and close working relationship with customers and suppliers can allow more targeted optimization with less iteration time.
Keywords
integrated circuit interconnections; low-power electronics; semiconductor industry; semiconductor materials; transistors; 3D transistor; copper metallization evolution; device integration; hardware control knobs; interface cleaning; low power high performance devices; manufacturing methods; physical-chemistry methods; precision material engineering; Chemicals; Copper; Materials; Process control; Surface cleaning;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-TSA.2014.6839632
Filename
6839632
Link To Document