• DocumentCode
    161611
  • Title

    Precision material engineering - an equipment point of view

  • Author

    Mei Chang

  • Author_Institution
    Appl. Mater., Sunnyvale, CA, USA
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Novel materials and specialty processes are expanding rapidly. Low power high performance devices 3D transistor, packaging and memory drove the demands. Innovation in new manufacturing methods/hardware and new chemistries are required to meet the challenges. Several examples in the past such as Cu metallization evolution and interface cleaning illustrate the efforts how the equipment vendor overcame the more demanding requirements by introducing more hardware control knobs (such as power, RF frequency, B field distribution, temperature zoning), introducing new chemicals (fine control chemical reaction pathway), new physical/chemistry methods (alternative energy form and source) and tempering with new elements. A proper implementation of advanced capabilities heavily depends on the applications. Better understanding of device integration and close working relationship with customers and suppliers can allow more targeted optimization with less iteration time.
  • Keywords
    integrated circuit interconnections; low-power electronics; semiconductor industry; semiconductor materials; transistors; 3D transistor; copper metallization evolution; device integration; hardware control knobs; interface cleaning; low power high performance devices; manufacturing methods; physical-chemistry methods; precision material engineering; Chemicals; Copper; Materials; Process control; Surface cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839632
  • Filename
    6839632