DocumentCode :
1616123
Title :
Identifying design systematics using learning based diagnostic analysis
Author :
Desineni, Rao ; Pastel, Leah ; Kassab, Maroun ; Fayaz, Mohammed Fazil ; Lee, Julie
Author_Institution :
300mm Diagnostics Characterization, IBM Syst. & Technol. Group., Hopewell Junction, NY, USA
fYear :
2010
Firstpage :
317
Lastpage :
321
Abstract :
With billions of transistors being integrated on a single chip by modern VLSI manufacturing processes, traditional yield learning techniques based on defect density present serious drawbacks. Manufacturing process simulation and yield prediction techniques based solely on random defects are increasingly deviating from the actual yields. Design rules are constantly being modified as new design marginalities are uncovered during yield learning, often without much statistical/yield validation. In this paper, we present a new diagnostic technique that merges volume diagnosis data with detailed layout analysis to quantify the true impact of design systematics. The presented technique has been successfully used at IBM to confirm or refute suspected design marginalities on multiple products manufactured in technologies ranging from 90 nm through 45 nm.
Keywords :
design for manufacture; diagnostic expert systems; integrated circuit design; integrated circuit manufacture; learning (artificial intelligence); design systematics; learning based diagnostic analysis; volume diagnosis data; Failure analysis; Inspection; Latches; Layout; Shape; Systematics; Upper bound; Yield learning; design-process systematic; physical design; systematic defects; volume diagnosis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-6517-0
Type :
conf
DOI :
10.1109/ASMC.2010.5551472
Filename :
5551472
Link To Document :
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