DocumentCode
1616123
Title
Identifying design systematics using learning based diagnostic analysis
Author
Desineni, Rao ; Pastel, Leah ; Kassab, Maroun ; Fayaz, Mohammed Fazil ; Lee, Julie
Author_Institution
300mm Diagnostics Characterization, IBM Syst. & Technol. Group., Hopewell Junction, NY, USA
fYear
2010
Firstpage
317
Lastpage
321
Abstract
With billions of transistors being integrated on a single chip by modern VLSI manufacturing processes, traditional yield learning techniques based on defect density present serious drawbacks. Manufacturing process simulation and yield prediction techniques based solely on random defects are increasingly deviating from the actual yields. Design rules are constantly being modified as new design marginalities are uncovered during yield learning, often without much statistical/yield validation. In this paper, we present a new diagnostic technique that merges volume diagnosis data with detailed layout analysis to quantify the true impact of design systematics. The presented technique has been successfully used at IBM to confirm or refute suspected design marginalities on multiple products manufactured in technologies ranging from 90 nm through 45 nm.
Keywords
design for manufacture; diagnostic expert systems; integrated circuit design; integrated circuit manufacture; learning (artificial intelligence); design systematics; learning based diagnostic analysis; volume diagnosis data; Failure analysis; Inspection; Latches; Layout; Shape; Systematics; Upper bound; Yield learning; design-process systematic; physical design; systematic defects; volume diagnosis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location
San Francisco, CA
ISSN
1078-8743
Print_ISBN
978-1-4244-6517-0
Type
conf
DOI
10.1109/ASMC.2010.5551472
Filename
5551472
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