DocumentCode :
161629
Title :
Thermal challenges to building reliable embedded systems
Author :
Zebo Peng
Author_Institution :
Embedded Syst. Lab., Linkoping Univ., Linkoping, Sweden
fYear :
2014
fDate :
28-30 April 2014
Firstpage :
1
Lastpage :
2
Abstract :
More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.
Keywords :
VLSI; embedded systems; integrated circuit reliability; integrated circuit testing; low-power electronics; thermal engineering; VLSI circuit testability; automotive electronics; medical applications; power-efficiency; reliable embedded systems; safety-critical areas; silicon technology scaling; test processes; thermal impacts; Clocks; Embedded systems; Integrated circuit reliability; Power demand; Temperature sensors; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-TSA.2014.6839642
Filename :
6839642
Link To Document :
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