DocumentCode :
161646
Title :
Influence of fin-width lateral variations of a FinFET
Author :
Prawoto, Clarissa C. ; Cheralathan, M. ; Mansun Chan
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2014
fDate :
28-30 April 2014
Firstpage :
1
Lastpage :
2
Abstract :
We have presented that, in terms of subthreshold operation, IOFF, SS and DIBL are improved in response to higher degree of lateral thickness non-uniformity. We have shown that the linearly varying film thickness of a FinFET introduces effects comparable to small variations in overall thickness. To address the non-uniformity, a correction factor for the overall thickness based on IOFF could be employed. Due to its non-trivial effects, this thickness variation angle should be considered as a parameter in FinFET modeling in order to capture a more accurate behavior, instead of only taking the average thickness.
Keywords :
MOSFET; semiconductor device models; FinFET modeling; correction factor; fin-width lateral variations; lateral thickness nonuniformity; linearly varying film thickness; nontrivial effects; subthreshold operation; thickness variation angle; Educational institutions; Electric potential; Films; FinFETs; Geometry; Logic gates; Performance evaluation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-TSA.2014.6839651
Filename :
6839651
Link To Document :
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