Power losses evaluation for modular multilevel converter with junction temperature feedback

Author

Tu, Qingrui ; Xu, Zheng

Author_Institution

Dept. of Electr. Eng., Zhejiang Univ., Hangzhou, China

fYear

2011

Firstpage

1

Lastpage

7

Abstract

This paper evaluates the converter power losses of the modular multilevel converter based HVDC systems (MMC-HVDC). A junction temperature feedback method is proposed in order to estimate the power losses more accurately. Based on the data provided by the manufacture, the characteristic of semiconductor device is acquired. Both the switching and conduction losses are calculated with the real-time voltage and current waveforms, which are derived from the detailed PSCAD/EMTDC model. Thermal circuit model is applied to estimate the average junction temperatures of the semiconductors. The converter valve losses with different heat sink temperatures are also investigated. Power losses evaluation results demonstrate that MMC topology has the lower valve losses than the 2-level or 3-level VSC topologies.

Keywords

HVDC power convertors; feedback; network topology; real-time systems; EMTDC model; HVDC system; MMC topology; PSCAD model; VSC topology; conduction loss; converter power loss; current waveform; junction temperature feedback method; modular multilevel converter; real-time voltage; semiconductor device; switching loss; thermal circuit model; Capacitors; Insulated gate bipolar transistors; Integrated circuits; Junctions; Switches; Switching loss; Temperature; junction temperature feedback; modular multilevel converter; power losses;

fLanguage

English

Publisher

ieee

Conference_Titel

Power and Energy Society General Meeting, 2011 IEEE

Conference_Location

San Diego, CA

ISSN

1944-9925

Print_ISBN

978-1-4577-1000-1

Electronic_ISBN

1944-9925

Type

conf

DOI

10.1109/PES.2011.6039038

Filename

6039038