Title :
A TSV-based heterogeneous integrated neural-signal recording device with microprobe array
Author :
Lei-Chun Chou ; Shih-Wei Lee ; Chuan-An Cheng ; Po-Tsang Huang ; Chih-Wei Chang ; Cheng-Hao Chiang ; Shang-Lin Wu ; Ching-Te Chuang ; Jin-Chern Chiou ; Wei Hwang ; Chung-Hsi Wu ; Kuo-Hua Chen ; Chi-Tsung Chiu ; Ho-Ming Tong ; Kuan-Neng Chen
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.
Keywords :
CMOS integrated circuits; biomedical electronics; biosensors; brain; microsensors; recorders; sensor arrays; signal processing equipment; three-dimensional integrated circuits; CMOS circuit; TSV-based heterogeneous integrated neural-signal recording device; biomedical applications; brain function investigation; electrical characteristics; microprobe array; miniaturized neural sensing microsystems; neural prostheses realization; Arrays; CMOS integrated circuits; Impedance; Noise; Probes; Sensors; Through-silicon vias; Bio-Signal Probe; CMOS MEMS; TSV;
Conference_Titel :
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location :
Hsinchu
DOI :
10.1109/VLSI-TSA.2014.6839692
