Integration issues for polymeric dielectrics in large area electronics [TFTs]

Author

Jeyakumar, R. ; Karim, K.S. ; Sivoththaman, S. ; Nathan, A.

Author_Institution

Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada

Volume

2

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

543

Lastpage

546

Abstract

The issues concerning the integration of polymeric low-permittivity (low-k) dielectrics in amorphous Si (a-Si) thin-film transistor (TFT) arrays have been investigated. A photosensitive spin-on polymer, photo-benzocyclobutene (PBCB), has been studied for integration as interlevel dielectric between the transistor and pixel levels in TFT arrays. The dielectric films were characterized by permittivity, stress, and planarization measurements. The dielectric constant was found to be in the range of 2.5-3.5. The degree of planarization was > 90%, and the film stress was about 60 MPa. Process parameters have been optimized for integration in TFT arrays. Measurements on test structures showed low leakage current and good electrical contact at via interconnections

Keywords

amorphous semiconductors; dielectric thin films; elemental semiconductors; leakage currents; permittivity; polymer films; silicon; thin film transistors; PBCB; a-Si; degree of planarization; dielectric constant; electrical contact; film stress; interlevel dielectric; large area electronics; leakage current; low-permittivity dielectrics; permittivity; photo-benzocyclobutene; photosensitive spin-on polymer; pixel levels; planarization measurements; polymeric dielectrics; process parameters; test structures; thin-film transistor arrays; via interconnections; Amorphous materials; Current measurement; Dielectric constant; Dielectric films; Dielectric measurements; Permittivity measurement; Planarization; Polymers; Stress measurement; Thin film transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics, 2002. MIEL 2002. 23rd International Conference on

Conference_Location

Nis

Print_ISBN

0-7803-7235-2

Type

conf

DOI

10.1109/MIEL.2002.1003316

Filename

1003316