Title :
Optical and electronic packaging process for silicon photonic systems
Author :
Pavarelli, Nicola ; Jun Su Lee ; Rensing, M. ; Eason, C. ; O´Brien, Peter A.
Author_Institution :
Tyndall Nat. Inst., Univ. Coll. Cork, Cork, Ireland
Abstract :
Fibre optic interconnection processes and hybrid integration of electronic devices for high-speed Si photonic systems are presented. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented.
Keywords :
elemental semiconductors; integrated optics; integrated optoelectronics; optical fibre couplers; optical interconnections; semiconductor device packaging; silicon; Si; advanced Si photonic foundry service; ePIXfab; electronic devices; electronic packaging; fibre optic interconnection; high-speed Si photonic systems; hybrid integration; optical packaging; silicon photonic systems; Couplers; Couplings; Integrated circuits; Optical fibers; Packaging; Photonics; Silicon;
Conference_Titel :
Optical Communication (ECOC), 2014 European Conference on
Conference_Location :
Cannes
DOI :
10.1109/ECOC.2014.6964237
