Design of new passive THz devices based on micromachining techniques

Author

Biber, Stephan ; Schur, Jan ; Hofmann, Arnd ; Schmidt, Lorenz-Peter

Author_Institution

Inst. for Microwave Technol., Univ. of Erlangen-Nuremberg, Erlangen, Germany

Volume

1

fYear

2004

Firstpage

26

Abstract

We present an overview on the latest results using micromachining techniques for the fabrication of THz-components. Different machining techniques was discussed with respect to their capability to generate complex 3-dimensional geometries with high aspect ratios and to meet the high mechanical requirements for THz-components. Exemplary results for the application of micromachining techniques for the design of new components were reviewed. We emphasizes the potential of silicon based microstructures for the manufacturing of new devices.

Keywords

LIGA; crystal microstructure; electroforming; elemental semiconductors; etching; micromachining; mixers (circuits); photoresists; rectangular waveguides; semiconductor device models; semiconductor process modelling; silicon; submillimetre wave antennas; 3-dimensional geometries; LIGA; Si; THz-components; antennas; backward wave oscillators; dielectric materials; electrical discharge machining; electroforming; micromachining techniques; microstructures; milling; mixers; passive THz devices; photoresists; silicon dry etching; silicon wet etching; waveguides; Geometry; Machining; Manufacturing; Micromachining; Micromechanical devices; Microwave technology; Milling; Optical waveguides; Silicon; Waveguide components;

fLanguage

English

Publisher

ieee

Conference_Titel

Physics and Engineering of Microwaves, Millimeter, and Submillimeter Waves, 2004. MSMW 04. The Fifth International Kharkov Symposium on

Print_ISBN

0-7803-8411-3

Type

conf

DOI

10.1109/MSMW.2004.1345782

Filename

1345782