Title :
Approach to solve the reliability problem at packaging level in the matrix VLSI
Author :
Vasiltsov, Igor V. ; Mandziy, Bohdan A. ; Bench, Andriy
Author_Institution :
Inst. of Comput. Informational Technol., Temopil Acad. of Nat. Economy, Ukraine
fDate :
6/24/1905 12:00:00 AM
Abstract :
In this paper the problem of increasing the reliability of the designed devices, implemented on the matrix VLSI has been considered. The proposed approach consists in choosing of the special area in the chip during mapping procedure at the packaging level. Usage of such approach allows for the designer to obtain a more optimal topology solution, and thus will increase the reliability of designed devices
Keywords :
VLSI; circuit optimisation; integrated circuit design; integrated circuit packaging; integrated circuit reliability; network topology; mapping procedure; matrix VLSI; optimal topology solution; packaging level; reliability problem; Chemical technology; Costs; Military computing; Packaging; Power generation; Power supplies; Power system reliability; Tellurium; Topology; Very large scale integration;
Conference_Titel :
Microelectronics, 2002. MIEL 2002. 23rd International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-7235-2
DOI :
10.1109/MIEL.2002.1003355
