Thermal Ta2O5 - alternative to SiO2 for high density dynamic memories

Tantalum pentoxide thin layers (10-100 nm) obtained by thermal oxidation of rf sputtered Ta films on Si have been investigated with respect to their dielectric, structural and electrical properties. It is established that stoichiometric Ta₂O₅ detected at the surface of the layers is reduced to tantalum suboxides in their depth. The oxide parameters are discussed in terms of a presence of an unavoidable ultrathin SiO₂ between Si and Ta₂O₅ and bond defects in both the oxide and the interface transition region. Conditions which guarantee obtaining high quality tantalum oxide with a dielectric constant of 32 - 35 and a leakage current less than 10^-7 - 10^-8 A/cm² at 1.5 V (SiO₂ equivalent thickness of 2.5 - 3 nm) are established. These specifications make the layers obtained suitable alternative to SiO₂ for high density DRAMs application