DocumentCode
1618730
Title
Coupling coefficients for signal lines separated by ground lines on PC boards
Author
Birchak, J.R. ; Haill, H.K.
Author_Institution
Reliability Inc., Houston, TX, USA
fYear
1989
Firstpage
190
Lastpage
198
Abstract
Signals propagating on PC (printed circuit) board traces are subject to overshoot and crosstalk, both of which increase as rise time decreases. Overshoot depends upon the ratio of self-inductance to capacitance to ground; crosstalk depends also upon mutual inductance between traces and trace-to-trace capacitance. Multilayer boards with ground planes close to traces are shown to decrease inductance and coupling capacitance, thereby tending to reduce overshoot and crosstalk. A similar reduction is obtained by placing grounded traces between signal traces. Equations which relate capacitive and inductive parameters to trace geometry, including intervening grounded traces, are presented. Examples of crosstalk, as calculated by a SPICE model using derived parameters, are shown
Keywords
circuit analysis computing; crosstalk; digital simulation; printed circuits; PC boards; SPICE model; capacitance; coupling capacitance; coupling coefficients; crosstalk; ground lines; intervening grounded traces; multilayer boards; mutual inductance; overshoot; self-inductance; signal lines; trace-to-trace capacitance; Capacitance; Crosstalk; Dielectrics; Equations; Geometry; Inductance; Microstrip; Permittivity; Slabs; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/TEST.1989.82294
Filename
82294
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