• DocumentCode
    1618730
  • Title

    Coupling coefficients for signal lines separated by ground lines on PC boards

  • Author

    Birchak, J.R. ; Haill, H.K.

  • Author_Institution
    Reliability Inc., Houston, TX, USA
  • fYear
    1989
  • Firstpage
    190
  • Lastpage
    198
  • Abstract
    Signals propagating on PC (printed circuit) board traces are subject to overshoot and crosstalk, both of which increase as rise time decreases. Overshoot depends upon the ratio of self-inductance to capacitance to ground; crosstalk depends also upon mutual inductance between traces and trace-to-trace capacitance. Multilayer boards with ground planes close to traces are shown to decrease inductance and coupling capacitance, thereby tending to reduce overshoot and crosstalk. A similar reduction is obtained by placing grounded traces between signal traces. Equations which relate capacitive and inductive parameters to trace geometry, including intervening grounded traces, are presented. Examples of crosstalk, as calculated by a SPICE model using derived parameters, are shown
  • Keywords
    circuit analysis computing; crosstalk; digital simulation; printed circuits; PC boards; SPICE model; capacitance; coupling capacitance; coupling coefficients; crosstalk; ground lines; intervening grounded traces; multilayer boards; mutual inductance; overshoot; self-inductance; signal lines; trace-to-trace capacitance; Capacitance; Crosstalk; Dielectrics; Equations; Geometry; Inductance; Microstrip; Permittivity; Slabs; Stripline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/TEST.1989.82294
  • Filename
    82294