Title :
A wireless and batteryless 130mg 300µW 10b implantable blood-pressure-sensing microsystem for real-time genetically engineered mice monitoring
Author :
Cong, Peng ; Chaimanonart, Nattapon ; Ko, Wen H. ; Young, Darrin J.
Author_Institution :
Case Western Reserve Univ., Cleveland, OH
Abstract :
In this paper, we present the design, implementation, and in vivo evaluation results of a wireless, batteryless, less-invasive, implantable blood-pressure-sensing microsystem for real-time monitoring of genetically engineered mice. The microsystem merges MEMS technology and low-power CMOS integrated circuit design through a high level of system integration, together with a conventional molding-based packaging technique. The implanted microsystem, consisting of a blood-pressure-monitoring unit interfaced with a low-power ASIC, can detect the blood pressure inside a vessel and wirelessly transmit the information to a nearby receiver, while using adaptive RF powering to ensure a stable system power supply. The system employs an instrumented elastic sensing cuff made of bio-compatible silicone by using a conventional molding process.
Keywords :
CMOS integrated circuits; DNA; bioMEMS; blood pressure measurement; blood vessels; capacitive sensors; cardiovascular system; genetic engineering; low-power electronics; ASIC; DNA sequences; MEMS capacitive pressure sensor; MEMS technology; RF powering; biological signal; biomedical implant; cardiovascular-related disease; genetic engineering; genetic variation susceptibility; implanted microsystem; low-power CMOS integrated circuit design; mass 130 mg; molding-based packaging technique; power 300 muW; real-time blood pressure measurement; real-time genetically engineered mice monitoring; sensor-artery contact; size 200 mum; wireless implantable blood-pressure-sensing microsystem; Application specific integrated circuits; CMOS integrated circuits; CMOS technology; Genetic engineering; In vivo; Integrated circuit packaging; Integrated circuit technology; Mice; Micromechanical devices; Monitoring;
Conference_Titel :
Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-3458-9
DOI :
10.1109/ISSCC.2009.4977491