Molded interconnects for high reliability undersea connector interfaces

In high reliability undersea, communication systems, the integrity of cable junctions, encapsulations and feed-through penetrations are paramount to overall system performance and longevity. Regardless of the system type or application, these interconnects must be designed and qualified to protect the signal and power paths of their respective hardware components. Various techniques have been employed with clear discriminators in resultant system reliability. These techniques include connectors, polyurethane encapsulation, adhesives and epoxies, polyethylene welding and polyethylene overmolding. High reliability joints in the telecom industry have historically incorporated the use of polyethylene molding to ensure the interface can withstand the high voltage, harsh environmental conditions and long life requirements for these systems. However, to ensure a reliable interconnect, material selection and qualification, mold design, mold cycle development, and stringent process controls are all critical to success. This paper will compare various interconnection and feedthrough techniques to that of polyethylene molding and discuss the critical parameters and processes needed to provide the highest reliability interconnect via polyethylene molding. The use of polyethylene molded interconnects for integration of commercial connectors has been designed and qualified for a high reliability undersea system. The molded connector interface design configuration and qualification testing methods and results are presented and discussed.