Title :
Analog BiCMOS technology
Author :
Hutter, L. ; Smith, J. ; Goon, J.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Design issues associated with developing an analog BiCMOS process technology are reviewed. This information is then highlighted with an example of BiCMOS process stressing modularity and component diversity. Future technology issues for next-generation processes are discussed
Keywords :
BiCMOS integrated circuits; integrated circuit technology; linear integrated circuits; analog BiCMOS process technology; component diversity; modularity; next-generation processes; Acceleration; BiCMOS integrated circuits; CMOS process; CMOS technology; Capacitors; Instruments; MOS devices; Substrates; Temperature; Threshold voltage;
Conference_Titel :
Circuits and Systems, 1992., Proceedings of the 35th Midwest Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0510-8
DOI :
10.1109/MWSCAS.1992.271260
