• DocumentCode
    1620155
  • Title

    SE6: Interleaving ADC´s - exploiting the parallelism

  • Author

    Roovers, Raf

  • Author_Institution
    NXP Semiconductors, Eindhoven, Netherlands
  • fYear
    2009
  • Firstpage
    518
  • Lastpage
    518
  • Abstract
    Why are interleaving ADC´s becoming more and more popular in recent years? Are other ADC architectures running out of steam and will interleaving ADC´s be the standard in the near future just as multi-core micro-processors are replacing single core? In this session an overview of recent developments in interleaving ADC´s is shown. Due to the shrinking area of a single converter, many slices can be integrated in parallel resulting in a new degree of freedom for ADC designers, resulting in higher speeds, better efficiency and more flexibility.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-3458-9
  • Type

    conf

  • DOI
    10.1109/ISSCC.2009.4977543
  • Filename
    4977543