The damaging impact of AC power contamination on the semiconductor and equipment during processing

Author

Shambrook, William J.

Author_Institution

ONEAC Corp., Libertyville, IL, USA

fYear

1988

Firstpage

178

Lastpage

182

Abstract

The impact of AC power HV transients on the semiconductor industry during design, lithography, wafer probe, burn-in and final test is examined. In each case the situation is reviewed, the protection problem defined, and the quantified performance enhancement presented. This covers yield and throughput improvement, increased system availability, reduced cost-of-manufacturing, increased testability and process stability and repeatability, upbinning, and reduced service and maintenance costs. Applications in both the commercial and military sectors are discussed.<>

Keywords

electromagnetic compatibility; integrated circuit manufacture; reliability; semiconductor device manufacture; surges; transients; AC power contamination; EMC; ROI; burn-in; cost-of-manufacturing; damaging impact; final test; lithography; maintenance costs; performance enhancement; process repeatability; process stability; protection problem; rapid return on investment; reliability; semiconductor industry; service costs; surges; system availability; testability; throughput improvement; transients; upbinning; wafer probe; yield; Availability; Contamination; Electronics industry; Lithography; Power system protection; Probes; Semiconductor device testing; Stability; System testing; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16172

Filename

16172