• DocumentCode
    1620685
  • Title

    Exploring ESD challenges in sub-20-nm bulk FinFET CMOS technology nodes

  • Author

    Shih-Hung Chen ; Hellings, Geert ; Thijs, Steven ; Linten, D. ; Scholz, Matthias ; Groeseneken, Guido

  • Author_Institution
    Imec, Leuven, Belgium
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Bulk FinFET is the main technology option for sub 20-nm CMOS nodes. However, newly introduced process options in advanced bulk FinFET technologies can result in significant deterioration of intrinsic ESD performance. In this work, the impact on ESD performance induced by the process options beyond 20 nm nodes is explored on different ESD devices. Furthermore, experimental results of SCR devices in bulk FinFET technology are demonstrated for the first time.
  • Keywords
    CMOS integrated circuits; MOSFET; electrostatic discharge; CMOS technology nodes; ESD; bulk FinFET; CMOS integrated circuits; CMOS technology; Electrostatic discharges; FinFETs; Layout; Logic gates; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0739-5159
  • Type

    conf

  • Filename
    6635964