Design and technology of flip chip and SMD devices integrated with LTCC module

Author

Jurków, Dominik ; Malecha, Karol ; Czok, Mateusz ; Roguszczak, Henryk ; Babiarz, Michal ; Golonka, Leszek

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland

fYear

2010

Firstpage

458

Lastpage

461

Abstract

Electrical circuit design and technology of flip chip audio amplifier integrated with LTCC module are presented in the paper. Electrical circuit layout was miniaturized. Interconnections reliability between chip and substrate were increased with special underfill. Bonding quality was analyzed with X-Ray inspection. All electronic components were encapsulated with special ceramic housing. Additionally technology of LTCC modules integrated with RF transmitters and receivers are presented in the paper.

Keywords

audio-frequency amplifiers; ceramic packaging; flip-chip devices; integrated circuit bonding; integrated circuit layout; surface mount technology; RF receivers; RF transmitters; SMD devices; X-ray inspection; electrical circuit design; electrical circuit layout; flip-chip audio amplifier; integrated LTCC module; interconnections reliability; Ceramics; Flip chip; Integrated circuit interconnections; Nonhomogeneous media; Substrates; Temperature sensors; LTCC; SIP; X-Ray; flip chip; thick-film;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7011-2

Electronic_ISBN

978-83-928756-4-2

Type

conf

Filename

5551647