Temperature fields and reliability of thick-film components under pulse mode operation

Author

Nowak, Damian ; Plawski, Szymon ; Dziedzic, Andrzej

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland

fYear

2010

Firstpage

375

Lastpage

378

Abstract

This paper presents experimental studies on temperature fields distribution in thick-film and LTCC (Low Temperature Co-fired Ceramics) microcircuits with heat sources represented by resistors and their reliability under pulse loads. Thermographic scanning system based infrared detector was applied for thermal mapping of components and digital multimeter was used for carrying out ageing tests. Obtained results give practical information about possible applications of such components in microelectronic circuits and their reliability in different working conditions.

Keywords

ageing; digital multimeters; infrared detectors; integrated circuit reliability; resistors; temperature distribution; thick film circuits; LTCC microcircuits; digital multimeter; heat sources; infrared detector; low temperature co-fired ceramics; microelectronic circuits; pulse loads; pulse mode operation; resistors; temperature fields; temperature fields distribution; thermal mapping; thermographic scanning system; thick-film components reliability; Microelectronics; Resistors; Substrates; Temperature distribution; Temperature measurement; Thermal conductivity; LTCC; microcircuit; reliability; resistor; temperature distribution; thick-film;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7011-2

Electronic_ISBN

978-83-928756-4-2

Type

conf

Filename

5551664