• DocumentCode
    1621289
  • Title

    Contactless measurement of conductivity of silicon wafers by millimeter waves

  • Author

    Ju, Y. ; Hirosawa, Y. ; Soyama, H. ; Saka, M.

  • Author_Institution
    Dept. of Mech. Eng., Tohoku Univ., Sendai, Japan
  • Volume
    1
  • fYear
    2004
  • Firstpage
    424
  • Abstract
    Silicon wafers are indispensable materials in the semiconductor industrial fields and have been widely used in various electrical devices. To control the quality of silicon wafers in the process of manufacturing, it is important to measure the electrical conductivity of the wafers. In the present paper, a method to measure electrical conductivity of silicon wafers by using a millimeter wave compact equipment is demonstrated. The principle of technique described here is based on the interaction of millimeter waves with silicon wafers. In order to measure the conductivity of silicon wafers by millimeter waves, a millimeter wave compact equipment was fabricated. This proposed technique is a powerful tool for the measurement of silicon wafers in a contactless fashion, independent of the thickness.
  • Keywords
    electrical conductivity measurement; elemental semiconductors; millimetre wave measurement; silicon; Si; contactless measurement; electrical conductivity; electrical devices; indispensable materials; millimeter wave compact equipment fabrication; semiconductor industrial fields; silicon wafers; Conducting materials; Conductivity measurement; Contacts; Electric variables measurement; Manufacturing industries; Manufacturing processes; Millimeter wave measurements; Millimeter wave technology; Semiconductor materials; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physics and Engineering of Microwaves, Millimeter, and Submillimeter Waves, 2004. MSMW 04. The Fifth International Kharkov Symposium on
  • Print_ISBN
    0-7803-8411-3
  • Type

    conf

  • DOI
    10.1109/MSMW.2004.1345916
  • Filename
    1345916