DocumentCode :
1621332
Title :
Embedded memories in a 32 bit high performance microcontroller
Author :
Eder, Alfred
Author_Institution :
Siemens Microelectron., San Jose, CA, USA
fYear :
1998
Firstpage :
4
Lastpage :
8
Abstract :
In recent years, there has been a constant demand for higher package pin counts due to higher chip complexity offered by increasingly sophisticated semiconductor technology. Microprocessors and telecommunication chips were some of the most active driving forces. This paper describes the exact opposite: approaches from the design side to tackle the pin count problem to actually reduce the demand on pin counts. Microcontrollers, in contrast to microcomputers, have almost all memory on-chip. However, with the newly created computing power of a 32 bit processor, the demands on memory, and especially on instruction memory, also increased. In most next generation applications, the expected memory requirements exceed affordable chip sizes if the memory is made from FLASH or SRAM. Embedded DRAMs are used to obtain the required bit density and low power consumption. Since internal wires are no big concern, a wide bandwidth from memory to core supports a full context switch in typically two cycles. The maximum data transfer rate is 2.4 GB/s in this case. Caches are used to compensate for poor DRAM performance in random access mode
Keywords :
DRAM chips; cache storage; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; microcontrollers; 2.4 Gbit/s; 32 bit; DRAM random access mode performance; FLASH memory; SRAM; bit density; cache memory; chip complexity; chip size; embedded DRAMs; embedded memories; full context switch; instruction memory; internal wires; maximum data transfer rate; memory-to-core bandwidth; microcontroller; microprocessors; on-chip memory; package pin count; power consumption; processor computing power; semiconductor technology; telecommunication chips; Computer aided instruction; Energy consumption; Microcomputers; Microcontrollers; Microprocessors; Random access memory; Semiconductor device packaging; Switches; Telecommunication computing; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-8433-X
Type :
conf
DOI :
10.1109/IPDI.1998.663612
Filename :
663612
Link To Document :
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