Design considerations and packaging of a Pentium(R) Pro Processor based multi-chip module for high performance workstation and servers

Author

Dudeck, Gary ; Dudeck, John

Author_Institution

MicroModule Syst. Corp., USA

fYear

1998

Firstpage

9

Lastpage

15

Abstract

This paper discusses the design strategies and trade-offs considered for the design and implementation of a 1 Mbyte second level cache version of Intel´s Pentium(R) Pro Processor. This document covers the design goals, packaging, and MCM routing, as well as discussion of simulation vs. measured results with regard to electrical and thermal aspects of the design

Keywords

cache storage; circuit analysis computing; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; microprocessor chips; multichip modules; network routing; 1 Mbyte; Intel Pentium Pro Processor; MCM routing; Pentium Pro Processor based multi-chip module; design considerations; design goals; design strategy; design trade-offs; electrical design; packaging; second level cache version Pentium Pro Processor; servers; simulation; thermal design; workstation; Manufacturing; Multichip modules; Packaging; Random access memory; Routing; Signal design; Sockets; System performance; System testing; Timing;

fLanguage

English

Publisher

ieee

Conference_Titel

IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-8433-X

Type

conf

DOI

10.1109/IPDI.1998.663613

Filename

663613