Title :
Design considerations and packaging of a Pentium(R) Pro Processor based multi-chip module for high performance workstation and servers
Author :
Dudeck, Gary ; Dudeck, John
Author_Institution :
MicroModule Syst. Corp., USA
Abstract :
This paper discusses the design strategies and trade-offs considered for the design and implementation of a 1 Mbyte second level cache version of Intel´s Pentium(R) Pro Processor. This document covers the design goals, packaging, and MCM routing, as well as discussion of simulation vs. measured results with regard to electrical and thermal aspects of the design
Keywords :
cache storage; circuit analysis computing; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; microprocessor chips; multichip modules; network routing; 1 Mbyte; Intel Pentium Pro Processor; MCM routing; Pentium Pro Processor based multi-chip module; design considerations; design goals; design strategy; design trade-offs; electrical design; packaging; second level cache version Pentium Pro Processor; servers; simulation; thermal design; workstation; Manufacturing; Multichip modules; Packaging; Random access memory; Routing; Signal design; Sockets; System performance; System testing; Timing;
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-8433-X
DOI :
10.1109/IPDI.1998.663613
