DocumentCode
1621484
Title
RF Driven Plasmas in Semiconductor Manufacturing
Author
Forster, John C.
Author_Institution
Appl. Mater., Santa Clara
fYear
2007
Firstpage
463
Lastpage
463
Abstract
Summary form only given. This talk will give a biased overview of the application of RF driven plasmas to semiconductor manufacturing. The advances in understanding plasma physics in such applications has occurred through the collaboration of many disciplines: plasma modeling/simulation, plasma diagnostics, basic plasma physics, and RF engineering. The evolution of sources will be discussed, from straight capacitively coupled plasmas, to inductively coupled plasmas, to the latest development of dual frequency capacitively coupled plasmas. Even some contributions from the often overlooked field of DC plasmas will be discussed. Some case studies from these fields will be discussed in depth. Many plasma physicists enjoy their studies due to the richness of plasma phenomena. However, semiconductor manufacturing applications rely on making the plasmas as "boring" as possible: plasma uniformity over the workpiece, and repeatabilitv are key. It will be shown that even in these "boring" plasmas, it is possible to uncover interesting phenomena.
Keywords
plasma diagnostics; plasma materials processing; plasma radiofrequency heating; plasma simulation; plasma sources; semiconductor technology; DC plasmas; RF driven plasmas; RF engineering; basic plasma physics; dual frequency capacitively coupled plasmas; inductively coupled plasmas; plasma diagnostics; plasma modeling; plasma simulation; plasma sources; plasma uniformity; semiconductor manufacturing applications; straight capacitively coupled plasmas; Artificial intelligence; Physics; Plasma applications; Plasma diagnostics; Plasma materials processing; Plasma simulation; Plasma sources; Radio frequency; Semiconductor device manufacture; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2007. ICOPS 2007. IEEE 34th International Conference on
Conference_Location
Albuquerque, NM
ISSN
0730-9244
Print_ISBN
978-1-4244-0915-0
Type
conf
DOI
10.1109/PPPS.2007.4345769
Filename
4345769
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