High-performance and low-cost plastic optical modules for the access network applications

Author

Tatsuno, K. ; Kato, T. ; Hirataka, T. ; Yoshida, K. ; Ishii, T. ; Kono, T. ; Miura, T. ; Sude, R. ; Shimaoka, M.

Author_Institution

Hitachi Ltd., Kokubunji, Japan

fYear

1997

Firstpage

111

Lastpage

112

Abstract

In this paper, we propose optical modules applying transfer molding or pre-transfer molded housings with optimized subassembly design as a low cost solution for the optical transmitter module. The size of the modules are the smallest to our knowledge and have pin compatibility with eight-pin dual-in-line mini-ceramic housing for the various communication network system applications

Keywords

modules; optical communication equipment; optical fabrication; optical fibre subscriber loops; optical transmitters; plastics; access network applications; communication network system applications; eight-pin dual-in-line mini-ceramic housing; high-performance plastic optical modules; low cost solution; low-cost plastic optical modules; optical transmitter module; optimized subassembly design; pin compatibility; pre-transfer molded housings; transfer molding; Ceramics; Costs; Electronics packaging; High speed optical techniques; Large scale integration; Optical fiber networks; Optical fibers; Optical transmitters; Plastic packaging; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Fiber Communication. OFC 97., Conference on

Conference_Location

Dallas, TX

Print_ISBN

1-55752-480-7

Type

conf

DOI

10.1109/OFC.1997.719738

Filename

719738