Title :
Influence of conductor systems on the crosstalks in integrated circuits
Author :
Novak, J. ; Foit, J. ; Janicek, V.
Author_Institution :
Dept. of Microelectron., Czech Tech. Univ. in Prague, Prague, Czech Republic
Abstract :
The advent of novel sub-micron technologies of IC fabrication led to such a decrease in lead-to-lead separation that it is not possible any more to neglect the influence of these leads on the reliability of the system operation. Both the small lead separation and the application of multilayer interconnecting systems cause parasitic electromagnetic couplings; in the case of a unipolar CMOS technology, the capacitive coupling is the dominant effect. It is impossible to measure direct the rapid variations voltage between leads inside the IC.
Keywords :
CMOS integrated circuits; conductors (electric); crosstalk; integrated circuit noise; IC fabrication; conductor systems; crosstalks; integrated circuits; lead-to-lead separation; multilayer interconnecting systems; parasitic electromagnetic couplings; unipolar CMOS technology; Capacitance; Conductors; Couplings; Integrated circuits; Interference; Lead; Transfer functions;
Conference_Titel :
Advanced Semiconductor Devices & Microsystems (ASDAM), 2010 8th International Conference on
Conference_Location :
Smolenice
Print_ISBN :
978-1-4244-8574-1
DOI :
10.1109/ASDAM.2010.5667016
