DocumentCode :
1623289
Title :
IC characteristic matching for optimal system performance
Author :
Stuchlik, Kenneth R.
fYear :
1989
Firstpage :
309
Lastpage :
315
Abstract :
The author addresses integrated-circuit performance characteristic-matching considerations for which multiple suppliers or technologies are required. It is suggested that, in order to ensure robust designs in high-performance systems, the variability between the required devices and suppliers should be minimized. The variability can be minimized through the evaluation of the critical performance characteristics, both specified and nonspecified, of all desired suppliers and technologies. The selection of suppliers or technologies may then be limited to those which are the most compatible or to a source with the most desirable characteristics. As performance requirements increase, the current specification methods and the parameters specified are becoming less and less adequate to ensure consistency in the design and manufacture of modern high-performance systems. A more desirable method may be to specify target means and distributions versus minimum/maximum limits. In addition, the requirement to specify performance-related parameters. Such as speed performance offsets or dynamic high- and/or low-level input voltage levels, should also be pursued. As an example, an outline of a basic study of the 74FXXX family of devices is presented
Keywords :
integrated circuit manufacture; integrated logic circuits; logic design; 74FXXX; IC characteristic matching; critical performance characteristics; high-performance systems; input voltage levels; logic design; optimal system performance; robust designs; speed performance offsets; variability minimisation; High speed integrated circuits; Integrated circuit manufacture; Integrated circuit technology; Manufacturing processes; Multiprocessing systems; Pins; Production; Robustness; System performance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/TEST.1989.82313
Filename :
82313
Link To Document :
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