• DocumentCode
    1623425
  • Title

    Development of Flexible Self Adhesive Patch for Professional Heat Stress Monitoring Service

  • Author

    Park, Duck Gun ; Shin, Seung Chul ; Kang, Sung Won ; Kim, Youn Tae

  • Author_Institution
    Basics Res. Lab., Electron. & Telecommun. Res. Inst., Daejeon
  • fYear
    2006
  • Firstpage
    3789
  • Lastpage
    3792
  • Abstract
    Too much exposure in a very hot environment can cause heat stress which leads to the fatal heat stroke. To prevent heat stress related diseases, flexible self adhesive patch for professional heat stress monitoring service has been developed. By using flexible printed circuit board (PCB) and silicone based packaging, high level of robustness and ease of usage has been accomplished. This patch can be repeatedly attached to the chest of the user with comfort. And it can stand the sweat and be washed with water to reuse. For this patch is small in size (9 cm triangle shape) and light in weight (55g), it can be used in the most demanding situation. To analyze the heat stress of user, it records 1 lead electrocardiogram, body temperature, humidity and 2-axis acceleration. It´s Bluetoothtrade communication module can connect various terminal device according to the configuration. With the body weight input by user and 3 week work log it can estimate user work load, acclimatization, total amount of work done, wet bulb globe temperature (WBGT) index, which is the screening criteria for heat stress exposure
  • Keywords
    Bluetooth; biothermics; electrocardiography; patient monitoring; printed circuits; silicones; 2-axis acceleration; 3 week; 55 g; Bluetooth; acclimatization; body temperature; electrocardiogram; fatal heat stroke; flexible printed circuit board; flexible self adhesive patch; humidity; professional heat stress monitoring service; silicone based packaging; user work load; wet bulb globe temperature index; Diseases; Flexible printed circuits; Humidity; Lead; Monitoring; Packaging; Robustness; Shape; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-8741-4
  • Type

    conf

  • DOI
    10.1109/IEMBS.2005.1617309
  • Filename
    1617309