DocumentCode :
1623497
Title :
Shielded high performance interconnect technology dramatically increases real signal density
Author :
Cohen, Tom ; Patel, Gautam
Author_Institution :
Teradyne Connection Syst. Inc., Nashua, NH, USA
fYear :
1997
Firstpage :
140
Lastpage :
145
Abstract :
Teradyne has developed a highspeed, high-density board-to-board interconnect, called VHDM, which will meet most industry needs with respect to mechanical and electrical characteristics. An extremely robust connector will be described with excellent mechanical attributes which also dramatically increases pin density and maintains a high level of signal integrity. This connector will provide up to 101 real signals per linear inch at sub-500ps risetimes for differential or single-ended applications. The paper will focus on the mechanical and electrical performance challenges that were overcome during the design of the product
Keywords :
crosstalk; electric connectors; printed circuit accessories; shielding; Teradyne; VHDM; board-to-board interconnect; electrical characteristics; mechanical attributes; mechanical characteristics; pin density; product design; robust connector; shielded high performance interconnect technology; signal density; signal integrity; single-ended applications; Conductors; Connectors; Contacts; Crosstalk; Electric variables; Frequency; Geometry; Impedance; Integrated circuit interconnections; Telecommunication computing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wescon/97. Conference Proceedings
Conference_Location :
Santa Clara, CA
ISSN :
1095-791X
Print_ISBN :
0-7803-4303-4
Type :
conf
DOI :
10.1109/WESCON.1997.632329
Filename :
632329
Link To Document :
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