EDA tools for high-performance MCM

Author

Maher, Mary Ann ; Khainson, Alexander

Author_Institution

DEC, USA

fYear

1998

Firstpage

70

Lastpage

73

Abstract

High density interconnect and MCM designs involve a variety of diverse technologies, including ceramics, laminates and deposited thin films as well as combinations of technologies such as hybrid MCM-D/L. Chips may be attached in CSP (chip scale packages) or via flip chip or bonded techniques. A design tool suite that encompasses all these substrate technologies, packages, chip packages and attaches requires a flexible design methodology. In this paper, we discuss a high density interconnect design methodology and describe the Tanner MCM Pro integrated MCM and IC design environment which combines strong features of both IC and PCB approaches to EDA and addresses the shortcomings of existing tools and design flows

Keywords

ceramics; circuit CAD; flip-chip devices; integrated circuit design; integrated circuit packaging; laminates; lead bonding; multichip modules; software tools; CSP; EDA; EDA tools; MCM; MCM design; Tanner MCM Pro integrated MCM/IC design environment; bonded technique; ceramics; chip attach; chip packages; chip scale packages; deposited thin films; design flow; design tool suite; flexible design methodology; flip chip technique; high density interconnect design; high density interconnect design methodology; hybrid MCM-D/L; laminates; packages; substrate technology; Bonding; Ceramics; Chip scale packaging; Design methodology; Electronic design automation and methodology; Flip chip; Integrated circuit interconnections; Laminates; Libraries; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-8433-X

Type

conf

DOI

10.1109/IPDI.1998.663624

Filename

663624