Development of packaging technologies for advanced SiC power modules

Author

Zhenxian Liang ; Wang, F. ; Tolbert, Leon

Author_Institution

Power Electron. & Electr. Machinery Group, OAK RIDGE Nat. Lab., Oak Ridge, TN, USA

fYear

2014

fDate

13-15 Oct. 2014

Firstpage

42

Lastpage

47

Abstract

A set of packaging technologies has been developed for promotion of SiC power devices in automotive applications. The technical advances include integrating single side cooling, three-dimensional (3-D) planar electrical interconnection, and integrated double sided direct cooling. The further integration of these features into one packaging process has been demonstrated with highly integrated SiC phase leg power module prototypes. The comprehensive improvements in module´s electrical, thermal performance and manufacturability help exploit fully the attributes provided exclusively by the wide bandgap (WBG) power semiconductors. The technical advancements lead to cost-effectiveness, high efficiency, high power density power conversion in electric drive system in modern vehicles.

Keywords

automotive electronics; integrated circuit interconnections; power conversion; power semiconductor devices; semiconductor device packaging; silicon compounds; wide band gap semiconductors; SiC; SiC phase leg power module prototypes; SiC power devices; automotive applications; cost-effectiveness; electric drive system; high power density power conversion; integrated double sided direct cooling; packaging technologies; three-dimensional planar electrical interconnection; wide bandgap power semiconductors; Cooling; Immune system; Multichip modules; Silicon carbide; Switches; Thermal resistance; SiC; direct cooling; double sided cooling; high density; integrated packaging; power module;

fLanguage

English

Publisher

ieee

Conference_Titel

Wide Bandgap Power Devices and Applications (WiPDA), 2014 IEEE Workshop on

Conference_Location

Knoxville, TN

Type

conf

DOI

10.1109/WiPDA.2014.6964621

Filename

6964621