Title :
Low-cost pigtailed PIN module with a novel solvent-bonding technique
Author :
Jiang, Ching-Long ; O´Neill, Shane ; Mak, Eric ; Reysen, Bill
Author_Institution :
Lytel Div., AMP Inc., Somervile, NJ, USA
Abstract :
In summary, a low-cost pigtailed PIN module based on novel solvent-bonding technique has been developed, modeled and characterized. Close agreement between the theoretically calculated and experimentally measured values has been achieved. This technique could be applicable to other optoelectronic packaging
Keywords :
adhesion; modules; optical fabrication; p-i-n photodiodes; semiconductor device packaging; semiconductor technology; low-cost pigtailed PIN module; optical fibre coupling; optoelectronic packaging; solvent-bonding technique; Assembly; Bonding; Curing; Fresnel reflection; Optical reflection; Optical refraction; Organic compounds; Resins; Stability; Stimulated emission;
Conference_Titel :
Optical Fiber Communication. OFC 97., Conference on
Conference_Location :
Dallas, TX
Print_ISBN :
1-55752-480-7
DOI :
10.1109/OFC.1997.719841
