Integration of polymer waveguide electro-optic modulators and VLSI electronics using standard lithographic fabrication techniques

In our vertical integration scheme, the photonics device is integrated directly above the electronics devices with an intermediate dielectric layer for isolation and planarization. We will describe our progress on many of the critical technologies that are needed for the monolithic integration of VLSI circuits and polymer modulators such as (i) planarization, (ii) protection of circuits to high voltage poling, (iii) interconnect vies in polymers and (iv) automatic v-groove alignment